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Halogen-free PCB Reliability Test and Failure Analysis

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Dołączył: 21 Lip 2019
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PostWysłany: Pon Sty 11, 2021 10:43    Temat postu: Halogen-free PCB Reliability Test and Failure Analysis Odpowiedz z cytatem

Halogen-free PCB Reliability Test and Failure Analysis

The Printed Circuit Board (PCB or PWB) is the base of electronic products. A PCB integrates and connects various electronic components to form a product assembly.To get more news about Halogen Free PCB, you can visit pcbmake official website.
PCB has a history of several decades. In the recent trend of miniature and light-weight electronic products added with promotion of lead-free processes, the assembling temperature of either reflow soldering or wave soldering gets higher, therefore the potential influence resulting from the additional thermal stress against the tranditional PCB becomes worse, hence product defects attributed to PCBs also worsen when compared to that before the transfer to lead-free processes. Although material suppliers developed high Tg substrate or improved hardening agents to overcome the thermal stress issue, other problems occurred, e.g., reduced Bond Pad Strength, poor hole-drilling quality, and Conductive Anode Filament (CAF) effect. Therefore PCB Reliability Test once more becomes highly focused.
Apart from the issue of lead-free application, international non-government organizations (NGO) actively promote Halogen Free processes. Meeting requirements of lead-free processes and Halogen limitations, We have developed a reliability test addressing properties of PCB materials to assist customers in obtaining certificate of preliminary product reliability tests or product sampling analyses.
Temperature Cycling Test (TCT) of PCB is the most popular and most important approach. TCT is normally accompanied with a dynamic resistance measurement system, e.g., a Datalogger or and event detector. The main purpose of TCT is to make use of the “CTE (Coefficient of Thermal Expansion) Mismatch” effect between ingredients with different thermal expansion coefficients. Quality risks in the product can be identified through the long-period high-/low-temperature cycling that leads to through-hole cracking and/or product delamination problems. This approach is highly beneficial to multi-layer products and HDI products; it can also identify and improve the strength, plating quality and process stability of the Lamination Bond. Temperature Cycling test can be performed together with non-dynamic tests where a set number of cycles is selected for measuring resistance values.
PCBs used for the temperature cycling test can be of the daisy chain design or of the actual products. The daisy chain design enables decrease of the sample number and provides more thorough observation of the product, which are more helpful in qualifying new suppliers.
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